The government has received proposals from five companies for setting up electronic chip and display manufacturing plants with an investment of Rs 1.53 lakh crore, an official statement said on Saturday.
In addition, SPEL Semiconductor, HCL, Sirma Technology and Valencani Electronics have registered for semiconductor packaging and Ratonsha International Rectifier has registered for compound semiconductors.
SPEL Semiconductor, HCL, Syrma Technology and Valenkani Electronics have registered for semiconductor packaging and Ruttonsha International Rectifier has registered for Compound Semiconductors.
The Ministry of Electronics and IT said Vedanta Foxconn JV, IGSS Ventures and ISMC have proposed to set up electronic chip manufacturing plants with an investment of USD 13.6 billion and sought USD 5.6 billion support from the Centre.
Vedanta and Elest propose to set up a display manufacturing unit with an estimated investment of USD 6.7 billion and have sought USD 2.7 billion support from the Center as part of the plan to set up a display fab in India.
In addition, SPEL Semiconductor, HCL, Sirma Technology and Valencani Electronics have registered for semiconductor packaging and Ratonsha International Rectifier has registered for compound semiconductors.
Three companies Terminus Circuits, Trispace Technologies and Curie Microelectronics have submitted applications under the Design Linked Incentive Scheme.